Latest Press Releases

--Piezo chip company demonstrates buttonless smartphone capability at CES 2019, Booth 1021 (Tech East, Westgate), January 8-11 in Las Vegas, Nev. LAS VEGAS — January 8, 2019 — Boréas Technologies, developer of ultra-low-power haptic semiconductor technologies, today introduced its SmartClik...
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Boréas Technologies, developer of ultra-low-power haptic technologies, today introduced the BOS1901, the lowest-power piezoelectric driver integrated circuit (IC) for high-definition (HD) haptic feedback in wearables and other battery-powered consumer devices.
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Boréas Technologies was part of the Mission Économique du Québec at the 2018 Consumer Electronics Show (CES), in Las Vegas, from January 8 to 12.
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