Boréas Technologies’ SmartClik Advances Buttonless Smartphones

Smartphone with Smartclik from Boréas Technologies

--Piezo chip company demonstrates buttonless smartphone capability at CES 2019, Booth 1021 (Tech East, Westgate), January 8-11 in Las Vegas, Nev.

LAS VEGAS — January 8, 2019 — Boréas Technologies, developer of ultra-low-power haptic semiconductor technologies, today introduced its SmartClik technology, a proof of concept for future buttonless smartphone designs. Using Boréas’ ultra-low-power piezoelectric (piezo) driver integrated circuit (IC), the BOS1901 — which provides high definition (HD) haptic feedback for the two piezo actuators next to the frame — SmartClik replaces the smartphone’s mechanical volume and power buttons, satisfying growing user demand for more sophisticated HD tactile feedback over staid push-button user interfaces.

Inside SmartClik Concept Phone

“Even today’s highest-end smartphones have just one haptic engine that shakes the whole phone when you push a button. This rudimentary implementation gates designers’ ability to improve the phone’s user interface,” said Simon Chaput, founder and CEO, Boréas Technologies. “SmartClik, on the other hand, uses Boréas’ piezo chip technology to transform haptic-feedback design. Each ‘piezo button’ becomes a localized haptic engine that supports area-specific tactile effects. Because it is software-programmable, SmartClik gives UI designers more versatility. Designers can customize localized haptic feedback for different applications, making gameplay and taking photos feel more realistic.

“SmartClik technology is also highly power-efficient,” added Chaput. “It’s the first technology platform that meets the requirements of buttonless smartphones without draining the battery. It actually saves 10X power over competitive piezoelectric haptic feedback solutions while enabling true HD touch.”

About SmartClik

SmartClik Concept Phone

SmartClik is buttonless proof-of-concept smartphone design based on Boréas’ BOS1901, the lowest-power piezo driver IC for HD haptic feedback in smartphones, wearables and other battery-powered consumer devices. SmartClik supports the customization of button “feel” in software, allowing designers to change button usage from application to application to create a multi-purpose user interface for many different use cases.

SmartClik’s piezo actuators are sensitive enough to detect pressure right through the phone’s frame. This enables better industrial design in end devices, supporting a unibody of stainless steel, aluminum or glass with the piezo actuators hidden under the frame.

Visit Boréas at CES 2019

Boréas will demonstrate SmartClik at Booth 1021 (Canadian Delegation) at Tech East, Westgate during CES® 2019 in Las Vegas, Nev. (January 8-11, 2019). To schedule a meeting or request more information, please email:

About Boréas Technologies

Boréas Technologies Inc. is a fabless semiconductor company commercializing product-differentiating piezo driver ICs for piezo actuators used in consumer and industrial markets. With origins in research conducted at Harvard University, Boréas was founded in 2016 in Bromont, Québec. Its proprietary CapDrive™ technology platform — on which the company’s driver ICs are based — is ideal for resource-constrained devices such as smartphones, game controllers, wearables and Internet of Things (IoT) devices.

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The Boréas logo is a registered trademark, and CapDrive is a trademark of Boréas Technologies Inc. All other product and company names are trademarks or registered trademarks of their respective holders.


Press Contacts

Nicolas Duchesne-Laforest, Boréas Technologies



Maria Vetrano, Vetrano Communications