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Boréas BOS1211 IC pairs with TDK Electronics 120V piezo haptic actuators to produce lifelike touch in automotive cabins LAS VEGAS — January 7, 2020 — Boréas Technologies, developer of ultra-low-power haptic technologies for consumer and commercial products, today demonstrated at...
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Boréas’ BOS1901CW enables realistic haptic feedback for mobile and wearable electronics — in a tiny low-power package SEATTLE — December 4, 2019 — Boréas Technologies, developer of ultra-low-power haptic technologies, today introduced the BOS1901CW, a Wafer Level Chip Scale (WLCSP)...
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Boréas showcases HD haptics in its buttonless smartphone design at Display Week 2019 SAN JOSE, Calif. — May 14, 2019 — Boréas Technologies, a developer of ultra-low-power, high-definition (HD) haptic technologies, today announced at Display Week 2019 a collaborative relationship...
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May 14, 2019 TDK Corporation (TSE:6762) announces that its subsidiary TDK Electronics has signed a cooperation agreement with Boréas Technologies Inc., developer of ultra-low-power haptic technologies, in order to accelerate the adoption of piezo haptic solutions in a broad range...
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![Smartphone with Smartclik from Boréas Technologies](http://www.boreas.ca/cdn/shop/articles/SideClik_-_Official_Photo_{width}x.jpg?v=1606315959)
--Piezo chip company demonstrates buttonless smartphone capability at CES 2019, Booth 1021 (Tech East, Westgate), January 8-11 in Las Vegas, Nev. LAS VEGAS — January 8, 2019 — Boréas Technologies, developer of ultra-low-power haptic semiconductor technologies, today introduced its SmartClik...
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