Press Center
Media Relations Contact
Nicolas Duchesne-Laforest
Communication and Marketing Manager
Email: nduchesnelaforest@boreas.ca
Media Resources
Press Releases
Boréas Technologies’ Piezo Driver Chip Advances Realistic Haptic Feedback in Automotive HMIs
Posted: January 7th, 2020
Boréas Technologies’ New Chip-Scale Haptic IC Drives HD Touch in Smallest Electronics
Posted: December 4th, 2019
TDK cooperates with Boréas on smart haptic solutions
Posted: May 14th, 2019
Boréas Technologies’ SmartClik Advances Buttonless Smartphones
Posted: January 8th, 2019
Boréas Technologies’ Ultra-Low-Power Haptic Chip Solves Power Problem with HD Touch
Posted: October 3rd, 2018
Boréas Technologies, developer of ultra-low-power haptic technologies, today introduced the BOS1901, the lowest-power piezoelectric driver integrated circuit (IC) for high-definition (HD) haptic feedback in wearables and other battery-powered consumer devices.
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Boréas Technologies was part of the Mission Économique du Québec at the 2018 Consumer Electronics Show (CES), in Las Vegas, from January 8 to 12.
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