Piezo Haptic
Trackpads

The Future of Computers is Haptic

Piezo Haptic Trackpads

Building Better Trackpads for Windows 11

Meet GlideSense*: The First Trackpad Using Boréas Piezo Technology

We announced in August 2021 a partnership with Cirque Corporation to build the industry's thinnest piezo haptic trackpad.

GlideSense* is the first production-ready piezo trackpad module that leverages both Cirque and Boréas technologies. *GlideSense is a trademark of Cirque Corporation

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Piezo Haptic Trackpads

Download our free whitepaper

Benefits of Boréas Piezo Haptic Trackpads

Razor Thin Module

Boréas Piezo haptic trackpads module can be as thin as 2.4mm and enables thinner high-end ultrabooks.

Hand sensing

Best HD Haptics Performance

The Boréas piezo haptic trackpad mechanical design is simple and enable uniform HD haptics on large surfaces.

Uniform Force Sensing

Our BOS1901 piezo driver integrated force sensing feature enables uniform force sensing across the entire trackpad surface.

Reliable Design

The BOS1901 piezo driver state-of-the-art architecture enables simplier and more reliable trackpad module designs.

Easy to Manufacture

Boréas is partnering with household names, like Cirque Corporation, in the trackpad industry to simplify manufacturing.

Design Friendly

Our piezo trackpad module is scalable to different sizes and form factors.

BOS1901 Piezo Haptic Trackpads vs The Competition

Characteristics Traditional Click Pad Leading LRA Trackpad Piezo Trackpad
Thickness (Touch + Haptics) 4 mm 3 mm <2.8mm
Haptic Feedback No Yes - LRA (narrow bandwidth) Yes - Piezo Actuator (wide bandwidth)
Force Sensing N/A Yes - With additional sensing hardware Yes - With same Piezo Actuator
Response Time > 50 ms > 20 ms < 5 ms
Structure Complexity Medium High Low
Weight 45 g 65 g 35 g

BOS1901 Piezo Driver

The Technology Behind Boréas Trackpads

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Free Guide on Building Piezo Haptic Trackpads

Don't be left behind. Start your haptic trackpad project today! Windows 11 now supports haptic trackpads. It's an important development for the industry, and OEMs will be able to build thinner computers that provide a more immersive experience. In this Whitepaper we'll go over how you can implement these features in your next project.