PEAK PERFORMANCE IN COMPACT DEVICES
Boréas’ CapDrive™ technology is revolutionizing thermal management in mobile devices. We've engineered an active micro-cooling architecture that brings the heat-dissipation power of liquid cooling to an unprecedented small form factor. This innovative approach combines our ultra-low power piezo drivers with a micropump and custom microchannel structures, creating a thermal system perfectly suited for smartphones, laptops, and AR/VR headsets where space is critical.
Unlike traditional passive cooling, Boréas solution delivers maximum thermal transfer without compromising your exterior device design. Our CapDrive™ architecture ensures ultra-low power consumption, moving massive amounts of heat while drawing only a fraction of a watt. This enables more powerful processors and sustained Edge AI performance in compact devices, keeping you from plateauing at your thermal limits.
Thermal management has emerged as the critical bottleneck for device performance. As the industry pivots towards on-device Edge AI, the integration of Neural Processing Units (NPUs) drives up Total Design Power (TDP) and generates unprecedented heat levels.
Traditional passive cooling relies entirely on surface area and has hit a hard physical limit. This challenge is even more pronounced in the foldable phone market, where the area for heat dissipation is halved, and static heat sinks fail to accommodate folding mechanisms.
This shift necessitates a paradigm change in heat management. To unlock pure processing headroom without expanding sleek form factors, manufacturers must transition from passive heat sinks to miniaturized active liquid cooling. Effective micro-cooling will undoubtedly become the key differentiator in the next generation of smart devices.
Flexible Integration
Our active cooling architecture leverages diverse microchannel heat spreader solutions adapted to your design reality and limited only by your thermal team’s creativity. This routing can integrate across hinges and curved surfaces, providing a versatile thermal path for high-performance foldables and wearable tech.
Ultra-Thin Profile
The heat exchange structures used in our cooling ecosystem can achieve an incredibly slim profile, with thicknesses as low as 0.35 mm. This allows you to safely relocate heat to underutilized zones within the device, bypassing the surface area bottleneck without expanding your physical footprint.
Minimal Power Draw
An active cooling system is useless if it drains the battery. Powered by our CapDrive™ technology, our ICs deliver 10X power savings over competing piezo solutions. It drives massive heat transfer with negligible power consumption, running at maximum efficiency without generating its own internal heat.
Recommended Part
For micropump liquid cooling applications, we recommend the Boréas Technologies BOS1931. To run Edge AI efficiently, you need serious heat extraction without the energy penalty. This single-chip driver delivers high-voltage, low-power performance specifically tuned for the physical loads of piezoelectric micropumps.
Compact and efficient, the BOS1931 features a fast start-up time of less than 300 µs to react dynamically to thermal spikes. Its ultra-small footprint saves critical PCB space, making it the perfect drop-in architecture for precise, responsive thermal management in heavily constrained build volumes.
