Why Passive Cooling Can't Keep Up with Edge AI: Microfluidic Cooling Solutions - Live Session

Edge AI is pushing more compute into smaller enclosures. Passive cooling was never built for that power density. Vapor chambers and heat pipes move heat, but past a certain power threshold, they cannot move it fast enough.

In this recorded session, Nate Coy (Sales) and Cédric Leclerc (Engineering) at Boréas Technologies break down why passive cooling hits that wall, and how solid-state microfluidic cooling driven by the BOS1931 solves it. The session includes a real case study and a walkthrough of the Boréas Blueprint.

What this session covers:

• Why passive cooling can't keep up with Edge AI power density
• How data center-grade liquid cooling fits inside a handheld device
• The BOS1931 driver and how it powers a piezoelectric micropump
• How a piezoelectric pump moves liquid without motors or check valves
• A case study applying microfluidic cooling to a compact Edge AI device
• The Boréas Blueprint for integrating microfluidic cooling into a design

Who this is for: Thermal engineers, hardware designers, Edge AI product teams, embedded systems developers.

Jump to a section 
0:00 Introduction
3:58 The passive cooling wall
7:00 Data center cooling in your pocket
10:00 The BOS1931
12:32 How a piezoelectric pump works
14:37 Piezo-driven liquid cooling
18:54 Case study
25:46 The Boréas Blueprint
33:25 Q&A

Go deeper:

• BOS1931 datasheet
• Microfluidic Cooling application page
• Can Passive Cooling Keep Up With Modern Smartphone SoCs?

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